A global leader in the field of medical imaging is looking for its future partner for the production of casing for its next generation of sensors.

A development phase will be necessary including a technology transfer from a research organisation and will start in Q1-2022. A period of 6 months is anticipated before entering into a pilot phase followed by a ramp up.

Who should apply ?

We are looking for companies with a passion for innovative process and experienced in open innovation collaboration. 

The component is a lightweight rigid structure with typical dimension in the range of 400x500x15mm. It will be composed of a thermoset matrix, foam elements and a thermally/electrically conductive element. The technology transfer will be focussed on the integration of this innovative element into the overall architecture. 

The casing needs a good finish quality. It should look smooth, without porosity, as well as it should be totally flat. The flatness tolerance is 0,5 mm (± 0,25mm) for the dimension listed above. The overall mass of the device is targeted below 750g. The structure should remain rigid: the deflection should not be more than 1mm under a 1200 N load.  The overall structure must be transparent to X-rays. 

This open call is now closed

Sorry, this open call is now closed

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Julien_CrebassaRzJulien CREBASSA

Innovation Business Developer